New PGS1000 Series of MEMS Thermal Conductivity Hydrogen Sensors for Safety Monitoring
Target Applications:
- Hydrogen leak detection and monitoring in industrial processes, medical facilities, and automotive fuel cells
Key Features:
- The hydrogen sensors consist of two thermal conductivity dies in a differential configuration, packaged in a compact surface-mount form factor
- For increased long-term stability, the devices detect hydrogen concentrations in the air by measuring the change in thermal conductivity of the gas mixture
- Posifa’s highly repeatable, high-volume CMOS MEMS technology lowers costs
Key Specifications and Benefits:
- Excellent signal-to-noise ratio
- Broadest available ranges, up to 100 % volume
- Fast response time of < 1.4 s
- Typical long-term stability of 0.1 % F.S./year
- Typical repeatability of 0.05 % F.S.
- Operating temperature: -25 °C to +85 °C
- Pulsed excitation minimizes the heater temperature for safe operation
The Context
PGS1000 series hydrogen sensors detect hydrogen concentrations in the air by measuring the change in thermal conductivity of the gas mixture. This measurement approach provides better long-term stability, and enables a smaller form factor, than hydrogen sensors that are triggered by chemical reactions that eventually cause the sensor to degrade. Posifa’s technology also allows the hydrogen detection capability to be realized at a much lower cost thanks to the company’s highly repeatable, high-volume CMOS MEMS technology.
The PGS1000 series is based on Posifa’s second-generation thermal conductivity die. The devices feature one die sealed in dry air and acting as a reference, while the other is exposed to the gas mixture. This design enables an excellent signal-to-noise ratio due to common-mode noise rejection and a maximization of the signal amplification. For safe operation, the sensor is excited with a pulsed waveform (400 ms on and 1,000 ms off) to minimize the heater temperature.
Availability
Samples and production quantities of the PGS1000 are available now.
Link to product datasheet
Link to application note
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